RECOGNITIONS

Listed in Marquis Who’s Who in Science and Engineering, 2001, USA

The family of Marquis Who’s Who publications presents unmatched coverage of the lives of today’s leaders and achievers from both the United States and around the world, and from every significant field of endeavor. Librarians, students, researchers, corporate executives, journalists, personnel recruiters, and many others rely on Marquis Who’s Who every day for in-depth biographical information they can use with confidence. 

Listed in Who’s Who in the World, 2002, USA

The family of Marquis Who’s Who publications presents unmatched coverage of the lives of today’s leaders and achievers from both the United States and around the world, and from every significant field of endeavor. Librarians, students, researchers, corporate executives, journalists, personnel recruiters, and many others rely on Marquis Who’s Who every day for in-depth biographical information they can use with confidence. 

Invited to be a Fellow of SIMTech, 2003-2005, Singapore

The SIMTech fellowship is a prestigious appointment given to staff from international universities. SIMTech extends invitations to renowned researchers worldwide to actively contribute to collaborative research projects and establish new capabilities within the institute.

Invited to be a Faculty Associate of IME, 2004-2011, Singapore

Presently, only a few selected faculty in NUS and NTU are invited to be a faculty associate to work on close research collaboration with IME. 

Awarded the Distinguish Professor in Asia, Mathwork Inc., 2004, USA

The first distinguished Professor in Asia by Mathwork in 2004 due to my pioneer work in using Matlab for reliability analysis.

Invited to be an adjunct Senior Scientist in SIMTech, 2006

There are only 2 faculty from NTU are invited to be an adjunct senior scientist in the entire SIMTech, leading
projects in SIMTech.

Elected to be IEEE Distinguished Lecturer for Electronic Device Society, 2007- now, USA

The EDS Distinguished Lecturer Program exists for the purpose of providing EDS Chapters with a list of quality lecturers who can potentially give talks at local chapter meetings. Nominations for EDS Distinguished Lecturers can only be submitted by EDS AdCom Members. Approval of all EDS Distinguished Lecturers occur twice a year at an EDS Educational Activities Committee (EduCom) Meeting which will be held in conjunction with the two AdCom Meetings. The resumes of the proposed distinguished lecturers will be distributed via email at least three weeks prior to the meeting. Currently, there are less than 150 EDS DL worldwide, and less than 40 in Region 10 of IEEE. Region 10 includes Asia and Australia.

Invitation to write monographs

Invitation to write a volume of ASSET (Series in Advances in Solid-State Electronics and Technology) edited by Prof C.T. Sah, published by the World Scientific, 2010. This is part of an authoritative review book in Solid State Electronics and Technology.

Invitation to write a review paper on ULSI Electromigration in the Material Science and Engineering Review
2007. (Impact factor: 13.902) Citation = 114 (Google); 85 (Scopus). It is at the top in Google Scholar list in November 2014.

Invitation to write a book on Finite Element Modeling for Electromigration published by Springer Verlag,
UK, 2011.

Invited to be in project proposal reviewer panel for National Projects from Malaysia (2002);
Hong Kong (2008); Canada (2009), and Austria (2009 and 2012)

Confer the International Biographical Centre Lifetime Achievement Award 2004

Invited to be in the Technical committee for IEEE ESTC (2010) and IEEE IRPS (2007, 2013)

Mentioned in Academia as a top 0.1% most read author after publishing 500 papers (July 2018)

Research Training

Mr. Li Wei, M.Eng student under my supervision, received the inaugural prestige 2007 IEEE Electronic Device Society Maters Student Fellowship. The award is to promote, recognize and support graduate Masters level study and research within the areas of all aspect of engineering, physics, theory, experiment and simulation of electron and ion devices involving insulators, metals, organic materials, plasmas, semiconductors, quantum-effect materials, vacuum, and emerging materials. Only five awards will be given internationally per year. This year, besides Li Wei from NTU, the other awardees are from MIT, Georgia Tech, University of Central Florida and University of Bucharest in Romania. Dr. Nagarajan Raghavan, who began his research in undergraduate level under my supervision, received 2011 IEEE EDS Ph.D Student fellowship, together with two others from University of London and University of California, Santa Barbara, CA, USA. He also was listed in the 2010 Trans. Of Electron Device Golden Reviewer list and 2012 Electron Device Lett Golden Reviewer list.

Recognition on Published Papers

Reliability work on solar cell is quoted in a widely read webnews VerticalNews 2011

One paper is listed as Top 25 hottest articles in Reliability Engineering and System Safety Journal in 2009

One paper entitled “Thermally Induced Stress in Partial SOI structure during high temperature processing” is selected and included in the CSA Materials Research Database.

One paper entitled “Aligned Carbon Nanotubes for Through-Wafer Interconnects” is also selected to be included in the 2007 issue of Virtual J. of Nanoscale Science and Technology.

One paper entitled “Temperature dependence of the field emission of multiwalled carbon nanotubes” is selected for the July 4, 2005 issue of Virtual J. of Nanoscale Science and Technology.

PUBLICATION STATISTICS (DETAIL PUBLICATION LIST IN APPENDIX)

No. Research Area # of Journal Papers # of Conference Papers Total # of papers # of Invited Talks # of Tutorials # of Keynote Speech
1
Interconnect Reliability*
46
45
91
13
2
3
2
Nanotechnology
23
22
44
2
1
2
3
Devices Reliability
16
11
27
5
1
2
4
Prognosis and Health Mgmt./ Predictive Maintenance
7
13
20
9
0
1

KEYNOTE AND INVITED TALKS/TUTORIALS

Tutorials

  1. C. M. Tan and Y. Liu. “Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system (Tutorial),” in IEEE Int. Electronic Packaging and Technology Conf., 2008.
  2. C. M. Tan. “Physics of electromigration in today ULSI interconnections (Tutorial),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.
  3. Cher Ming Tan, “Statistical Analysis of Reliability Test Data”, one day workshop– Characterization, Modeling and Reliability Issues on Nano Materials and Devices, Chennai, India, 2nd March, 2016.
  4. Cher Ming Tan, “Introduction to Reliability (Tutorial),” in IEEE 23rd International Symposium on the Physical and Failure Analysis of Intergrated Circuits, Marina Bay Sands, Singapore, 18-21 July, 2016.
  5. Cher Ming Tan, “Statistical Analysis of Reliability Test Data (Tutorial),” in 2016 Taiwan ESD and Reliability Conference (TESDC-2016), Hsin Chu, Taiwan, Oct. 31-Nov. 2, 2016.
  6. Cher Ming Tan, “Applications of finite element modeling in Reliability Studies (Tutorial)”, in 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017), Cheng Du, China, 4-7 July, 2017.
  7. Cher Ming Tan, “Failure Analysis in Semiconductor Package Assembly”, in Electronic Packaging Convention (EPCON), Penang, Malaysia, 7th-9th August 2018.

Keynote Talks

  1. Cher Ming Tan, “Reliability Data Analysis (Keynote)”, IEEE Invited talk organized by Rel/CPMT/ED chapter, 2002. 
  2. C. M. Tan. “Electromigration in ULSI Interconnection (Keynote),” in 1st Microreliability and Nanoreliability Congress, Germany, 2007.
  3. C. M. Tan, M. D. Le, and F. Leng. “SoC and SoH Estimation of battery cell and modules for electric vehicles (Keynote),” in IEEE Annual PHM Conf., Beijing, China, 22nd-24th May 2012.
  4. Cher Ming Tan, “Li Ion Battery Pack Reliability Assurance(Keynote)”, in 4th International Symposium on Energy Challenges and Mechanics, Scotland, UK, 11-13 August, 2015.
  5. Cher Ming Tan, Udit Narula, Dipesh Kapoor, “Reliability Paradox of Automotive Electronics(Keynote)”,   International Conference on Electrical, Electronics, and Optimization Techniques 2016(ICEEOT 2016), Chennai, India, 3rd-5th March, 2016.
  6. Cher Ming Tan, “Applications of Finite Element Modeling in Reliability Studies(Keynote)“, in 2nd International Conference on Intelligent Communication, Control and Devices (ICICCD), Dehradun, India, 15-16th April, 2017.
  7. Cher Ming Tan, “Reliability in IoT Era (Keynote)“, 2nd International Conference on Telecommunication and Networks (TEL-NET), Delhi, India, 10-11th August 2017.
  8. Cher Ming Tan, “Reliability of Solder Interconnect (Keynote)”, Singapore Symposium on Interconnect Reliability(SSIR) 2017, Singapore, 25-26 September, 2017.
  9. Cher Ming Tan, “Changing Degradation Mechanisms in Silicon Integrated Circuits (Keynote)”, 7th Annual World Congress of NanoScience & Technology 2017, Fukuoka, Japan, 24th-26th Oct., 2017.
  10. Cher Ming Tan, “Necessity for quantitative reliability evaluation”, International Symposium on Failure, Reliability & Integrity of Engineering Systems, Dehradun, Uttarakhand, India, 8 September, 2018.
  11. Cher Ming Tan, “Necessity for quantitative reliability evaluation for engineering systems”, Workshop on Life Cycle Reliability of Engineering Systems, Jorhat, Assam, India, 22-23rd April 2019.
  12. Cher Ming Tan, “Necessity of quantitative reliability evaluation”, 1st International Conference on Ubiquitous and Emerging Concepts on Sensors & Transducers, Kolkata, India, 25-27th April, 2019.
  13. Cher Ming Tan, “Use of Graphene to overcome the bottleneck in VLSI Interconnections”, 29th Assembly of Advanced Materials Congress (29th AMC – 2019), Sweden, 9-11th October 2019.
  14. Cher Ming Tan, “Maintenance 4.0 – Data Analytic in Maintenance” VCIPECH 2020, 6th Nov, 2020

Invited Talks

  1. C. M. Tan and G. Zhang. “Investigation of the physical processes during electromigration of ULSI interconnection (Invited),” in ANSYS User Meeting, 2003. 
  2. East China Normal University, China, “Low temperature Wafer bonding (Invited)”, 2003.
  3. Fudan University, China, “Reliability Data Analysis (Invited)”, 2003.
  4. Cher Ming Tan, “Methodology for Build-in Reliability(Invited)”, Invited workshop in International Quality and Process Control Conference, Bangkok, Thailand, Jan 2004.
  5. C. M. Tan, B. K. Khoo, and J, Png. “Determining maintenance strategy from root cause analysis and reliability data analysis (Invited),” presented at Annual Reliability, Availability, Maintainability and Safety Conf., Kuala Lumpur, Jun. 2004. 
  6. C. M. Tan, B. K. Khoo. “Application of FMEA for build-in reliability and maintenance (Invited),” presented at Industrial Talk, 2004. 
  7. C. M. Tan. “Identifying key parameters for risk based inspections (RBI) and failure mode effect analysis (FMEA) (Invited),” presented in International Quality and Process Control Conference, Bangkok, Jan. 2004. 
  8. C. M. Tan. “Reliabiilty Analysis and Application with MATLAB (Invited),” presented at Industrial seminar, May 2004. 
  9. C. M. Tan. “Maintenance policy for predictive maintenance (Invited),” presented at 6th Annual Plant Reliability and Maintenance, Kuala Lumpur, Dec. 2005. 
  10. C. M. Tan. “Predictive maintenance and its impact to business decision (Invited),” presented at Strategic Maintenance Congress, Dec. 2005. 
  11. C. M. Tan. “Is electron wind force the sole driving force in electromingration of ULSI interconnection? (Invited)” in Int. Conf. on Materials for Advanced Technologies, 2005. 
  12. C.M. Tan. “ULSI Interconnect Reliability (Invited)”, invited talk in the Workshop on Technology of Si-based Nanodevices, Singapore 2006. 
  13. C. M. Tan and W. Li. “A holistic numerical modeling for interconnect electromigration (Invited),” presented at Int. Materials Research Society Conf., Chongqing, China, Jun. 2008. 
  14. C.M. Tan. “Finite element modeling for Interconnect Reliability Study (Invited)”, in 7th ASEAN ANSYS Conference, Singapore 2008. 
  15. C. M. Tan and F. He. “3D circuit model for 3D IC reliability study (Invited),” in 10th International Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSIME), 2009. 
  16. C.M. Tan. “Solid State Lighting Reliability (Invited)”, invited talk in Industry Event on Solid State Lighting organized by A*Star 2009 (only NTU speaker).
  17. C.M. Tan. “TSV Reliability (Invited)” invited talk in IME Industry Forum, 2009.
  18. C.M. Tan. “Product Excellence in Global Competitive Market (Invited)”, in SQI/SPA Symposium, Singapore 2009.
  19. C. M. Tan, B. K. Chen, and M. Xiong. “Study of humidity reliability of high power LEDS (Invited),” in IEEE Int. Conf. on Solid-State and Integrated Circuit Technology, Shanghai, 2010, pp. 1592-1595. 
  20. Cher Ming Tan, “New Driving Forces in ULSI Electromigration and its implication to IC Designers(Invited)”, in San Jose, USA 2010.
  21. W. Li and C. M. Tan. “Black’s equation for today’s ULSI interconnect electromigration (Invited),” in Proc. of IEEE Electron Devices and Solid State Circuits, China, 2011.
  22. C. M. Tan, C. Baudot, Y. D. Han, and H. Jing. “Applications of multi-walled carbon nanotube (Invited),” in IEEE Int. Nanoelectronics Conf., Taiwan, Jun. 2011.
  23. C. M. Tan, Z. Gan, and W. Li. “Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited),” presented at Int. Conf. on Materials for Advanced Technologies, Singapore, Jul. 2011. 
  24. C. M. Tan, M. D. Le, and F. Leng. “Estimation of SoC/SoH of cell and RUL of battery pack for EV Application (Invited),” in IEEE Battery Management Systems for High Operational Availability and Safety Conf., Shenzhen, China, 21st May 2012. 
  25. C. M. Tan and C. Fu. “Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited),” in Proc. of IEEE ICSICT, Xi’an, China, 29th Oct. – 1st Nov. 2012. 
  26. C. M. Tan. “Recent Development of Reliability and Maintenance (Invited),” in TUV SÜD PSB Testing, Inspection and Certification Conf., Singapore, Sep. 2012.  
  27. C. M. Tan and F. He. “3D electromigration modeling at circuit level (Invited),” in Taiwan ESD and Reliability Conf., Hsinchu, Taiwan, 5-7th Nov. 2012.  
  28. C. M. Tan. “Study of humidity reliability of solid state lighting (Invited),” in LED Display and Lighting System Symp., Shenzhen, China, 18-19th Jul. 2012. 
  29. Cher Ming Tan, Shuai Zhang, Feifei He, Xi Zhu and Haibin Su, “Model the Physics of Micro-crack formation in Alumimum under high temperature cycling (Invited)”, in International Conference on Small Science, Las Vegas, USA, 2013.
  30. Cher Ming Tan and Xiangchen Chen, “ESD Degradation Modeling of Gate-All-Around Silicon Nanowire Device (Invited)”, in Collaborative Conference on Materials Research, Korea 2013. 
  31. Cher Ming Tan, “Extending electromigration modeling from test structures to Integrated circuit layout level (Invited)”, in International Reliability Physics Symposium, 2014, USA.
  32. Cher Ming Tan and Preetpal Singh, “Reliability Lifetime Extrapolation of high power LEDs under humidity test – A revisit (Invited)”, in 2014 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), Chengdu, China, 2014. 
  33. Cher Ming Tan, “Product Reliability Assurance – The manifestation of the Core Values of Chinese Culture (Invited)”, in 2nd Chinese Quality Forum, Hong Kong, 2014. 
  34. Cher Ming Tan and Udit Narula, “Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test(Invited)”, in 2014 IEEE International Conference on Solid State and Integrated Circuits Technology, Guilin, China.
  35. Feng Leng and Cher Ming Tan, “A methodology for studying the effect of overcharge on the safety of lithium-ion batteries (Invited)”, in 5th Annual Battery Safety Conference, Washington, USA, 2014.
  36. Cher Ming Tan and Preetpal Singh, “Exploring the Humidity Effect on the Reliability of High Power LEDs (Invited)”, in International Electron Devices and Materials Symposium, Hualian, Taiwan, November, 2014.
  37. Cher Ming Tan and Feng Leng, “Internal probing into the degradation processes in Lithiumion batteries under cyclic aging (Invited)”, The 1st International battery Safety Workshop, Munich, Germany, 25-26 August, 2015.
  38. Udit Narula, Chao Sung Lai, Cher Ming Tan, “Determination of Key Factors for Low Temperature Graphene Synthesis using Design of Experiments Approach (Invited),” in 7th IEEE International Nanoelectronics Conference, Chengdu, China, 9-11 May, 2016.
  39. Cher Ming Tan, “Effect of ULSI Interconnect layout on its electromagnetic emission (Invited),” in International Conference on Solid-State and Integrated Circuit Technology, Hangzhou, China, 25-28 Oct., 2016.
  40. Cher Ming Tan, “ULSI Interconnection electromigration and its EMI performance (Invited),” in IEEE International Microwave, Electron Devices, Solid-State Circuit Symposium(IMESS2016), Penang, Malaysia, 9-10 Nov., 2016.
  41. Cher Ming Tan, “Degradation Physics of High Power LEDs in Outdoor Applications (Invited),” in 13th China International Forum on Solid State Lighting (SSL CHINA 2016), Beijing, China, 15-17 Nov., 2016.
  42. Cher Ming Tan, “Applications of Finite Element Modelling in Reliability (Invited)“, Symposium on Reliability of Semiconductors and Packaging Testing, Hsinchu, Taiwan, 10th February, 2017.
  43. C. M. Tan, “Non destructive examination of Li Ion Battery (Invited)“, International Battery Safety Workshop, New Mexico, USA, 9-10th May, 2017.
  44. Cher Ming Tan, “Finite element analysis for the understanding of physics of failure in Microelectronics (Invited)”, 2017 IEEE Electron Devices Mini-Colloquium, Chengdu, China, 3rd July, 2017.
  45. Cher Ming Tan, Preetpal Singh, Wenyu Zhao and Hao-Chung Kuo, “Limitations of Phosphor layer thickness and Drive Current for White LEDs (Invited)“, Pacific Rim Conference on Lasers and Electro-Optics (CLEO-Pacific Rim), 22nd OptoElectronics and Communications Conference (OECC) and  5th Photonics Global Conference (PGC), Singapore, 31st July-4th August, 2017.
  46. Cher Ming Tan, “Practicality and Importance of Advanced Reliability Technology to Industry (Invited)“, Reliability & Failure Analysis Technology Seminar, Taiwan, 23rd August 2017.
  47. Cher Ming Tan, “Necessity of Quantitative Reliability Evaluation (Invited)“, Cadmen CAE applications Annual Meeting, Taiwan, 31st October 2017.
  48. Cher Ming Tan, “Necessity of Quantitative Reliability Evaluation (Invited)”, 第二屆全球華人品質峰會, Danshui, Taiwan, 16th-17th Nov. 2017.
  49. Cher Ming Tan, “Interconnect Reliability Assurance through Electrical Testing (Invited)”, 19th Electronics Packaging Technology Conference (EPTC 2017), Singapore, 6th-9th Dec. 2017.
  50. Cher Ming Tan, “A novel interconnect material for the challenges in high speed and high reliability chips(Invited)”, 2017 IEEE Electrical Design for Advanced Packaging Symposium, Hangzhou, China, 14-16th Dec. 2017.
  51. Cher Ming Tan, “Realistic DfR in digital age for electronics”, 2018 World Conference on Quality and Improvement, Seattle USA, 30 Apr – May2, 2018.
  52. Cher Ming Tan, “New Driving force for electromigration in today VLSI Interconnections”,  EDS-Distinguished Lecture at IIT Kanpur, Uttar Pradesh, India, 5th September, 2018.
  53. Cher Ming Tan, “An illustration of predictive maintenance on medical instruments using haemodialysis machines”, 16th ANQ Congress 2018, Almaty, Kazakhstan, 19-20 September 2018
  54. Cher Ming Tan, “Degradation mechanism for CdSe quantum dot down converted LEDs”, 14th International Conference on Solid-State and Integrated Circuit Technology, Qingdao, China, 31 Oct – 3 Nov, 2018.
  55. Cher Ming Tan, “Identification of Electromagnetic Hot spot in Integrated Circuit” 6th International Conference on Signal Processing and Integrated Networks (SPIN 2019), Noida, Uttar Pradesh, India, 7 – 8 March 2019.
  56. Cher Ming Tan, “Product Excellence in Global Competitive Market”, Zhejiang University, Hangzhou, China, 9 April 2019.
  57. Cher Ming Tan, “Why things fails and why do we bother about it”, Workshop on Life Cycle Reliability of Engineering Systems, Jorhat, Assam, India, 22-23rd April 2019.
  58. Cher Ming Tan, “Quality Method for Product Reliability Assurance”, International Industrial Reliability Workshop (IIRW), Taoyuan, Taiwan, 30th April 2019. 
  59. Cher Ming Tan, “Reliability Challenges of Nano-Interconnects”, IEEE EDS Mini Colloquium (MQ) on Emerging Nanoscale Devices: Compact Modeling and Reliability, Roorkee, Uttarakhand, India, 4th May 2019.
  60. Cher Ming Tan, “High Power LED Packaging Reliability-an Overview”, International Congress on Advanced Materials, Sciences and Engineering, Osaka, Japan, 22-24th July, 2019.
  61. Cher Ming Tan, “Principle of failure rate computation in IEC standards and limitations”, Taoyuan, Taiwan, 5th Sep, 2019.
  62. Cher Ming Tan, “Fundamental principle in reliability prediction”, Taoyuan, Taiwan, 5th Sep, 2019.
  63. Cher Ming Tan, “Ensure product reliability beyond IEC standards”, Taoyuan, Taiwan, 5th Sep, 2019.
  64. Cher Ming Tan, “Battery and component reliability evaluation method”, Tainan, Taiwan, 10th Sep, 2019.
  65. Cher Ming Tan, “Applications of Finite Element Analysis for Product Reliability Evaluation”, New Taipei City, Taiwan, 4th Oct, 2019.
  66. Cher Ming Tan, “Applications of Finite Element Analysis for Product Reliability Evaluation” Kaohsiung, Taiwan, 16th Oct, 2019.
  67. Cher Ming Tan, “A composite material for interconnections in advanced electronics” Polymer and Composite Materials, 4th Nov, 2020

EXTERNAL RESEARCH GRANTS RECEIVED

SUPERVISION OF POSTGRADUATE WORKS

PATENTS AND COPYRIGHT